Electronic devices emit electromagnetic interference (EMI) and radio frequency interference (RFI) that can interfere with the operation of other devices. To prevent this interference, manufacturers use EMI/RFI shielding techniques. Two common shielding techniques are board level shielding and EMI/RFI gaskets. Both techniques have their advantages and disadvantages, and choosing the right one depends on several factors. In this article, we’ll discuss the differences between board level shielding and EMI/RFI gaskets and help you determine which technique is best for your device.

Board level shielding is a technique where metal shielding is integrated into the printed circuit board (PCB) of a device. This type of shielding creates a conductive enclosure around the electronic components, blocking EMI and RFI from escaping the device. Board level shielding is typically made of metal, such as copper, and is designed to fit snugly over the electronic components. This technique is effective for high-frequency signals, as it creates a low-impedance path for EMI and RFI to follow, reducing the electromagnetic emissions from the device.

EMI/RFI gaskets are another type of shielding technique that uses a gasket material, such as conductive silicone, to create a seal between two surfaces. The gasket material creates a conductive barrier that blocks EMI and RFI from entering or exiting the device. EMI/RFI gaskets are typically installed around the perimeter of the device, creating a complete enclosure around the electronic components. This technique is effective for low-frequency signals, as it creates a high-impedance path for EMI and RFI to follow, reducing the electromagnetic emissions from the device.

When it comes to choosing between board level shielding and EMI/RFI gaskets, several factors need to be considered, including the frequency range of the device, the size and shape of the device, and the level of EMI and RFI that the device emits. Here are some things to consider when deciding which technique is best for your device:

Frequency range: Board level shielding is typically more effective for high-frequency signals, while EMI/RFI gaskets are more effective for low-frequency signals. If your device emits high-frequency signals, board level shielding may be the best choice. If your device emits low-frequency signals, EMI/RFI gaskets may be the better option.

Size and shape of the device: Board level shield is more difficult to install in irregularly shaped devices or devices with limited space. EMI/RFI gaskets can be custom cut to fit any shape or size, making them a better choice for devices with irregular shapes.

Level of EMI and RFI emissions: If your device emits high levels of EMI and RFI, board level shielding may be the best option. Board level shielding provides a more complete enclosure around the electronic components, reducing the electromagnetic emissions from the device. However, if your device emits low levels of EMI and RFI, EMI/RFI gaskets may be a more cost-effective option.

Cost: Board level shielding is typically more expensive than EMI/RFI gaskets. If cost is a concern, EMI/RFI gaskets may be the better choice.

In conclusion, both board level shielding and EMI/RFI gaskets are effective shielding techniques for electronic devices. The choice between the two depends on several factors, including the frequency range of the device, the size and shape of the device, and the level of EMI and RFI that the device emits. By considering these factors and choosing the right technique, you can ensure that your device is effectively shielded from EMI and RFI, reducing interference and ensuring reliable operation.